李海龙讲师

Email: dragoneptech@163.com

研究所：焊接与先进制造技术研究所

教育背景：

· 2011.09-2015.10 哈尔滨工业大学材料加工工程专业 工学博士

· 2009.09-2011.07 哈尔滨工业大学材料加工工程专业 工学硕士

· 2005.09-2009.07 哈尔滨工业大学焊接技术与工程专业 工学学士

工作经历：

· 2015.12-至今 304永利登录入口304永利登录入口材料加工系 讲师

· 2018.10-2020.08 美国加州大学洛杉矶分校 国家公派博士后

研究方向

· 研究领域：

电子封装技术、微纳连接技术、可靠性分析与测试技术、数值仿真分析

· 讲授课程：

本科生课程：《半导体器件物理》、《电子材料》、《快速成型技术》

研究生课程：《钎焊与微连接》

标志性成果

发表论文（通讯作者和第一作者）：

· Jianghao Yu, Xiaobin He, Xingyu Pan, Shiguang Hao,Hailong Li. Practical method for studying the dispersion behavior of TiC nanoparticles in molten Mg [J]. Computational Materials Science, 2024, 238: 112927.

· Lin Qi, Weiling Xu, Jianghao Yu, Qiang Liu, Danfeng Xie, Yanwei Wu, Ruidong Yang, Jingzhao Zhang, Hefeng Zhang,Hailong Li. Reliability analysis of random vibration for a CCGA624 component based on an improved Miner’s rule [J]. Journal of Materials Science: Materials in Electronics, 2023, 34(36): 2318.

· Shiguang Hao,Hailong Li. Effect of twin grain boundary on the diffusion of Cu in bulk β-Sn [J]. Computational Materials Science, 2023, 226: 112200.

· Xuehong Zhang,Hailong Li, Tao Wang, Shiguang Hao. A case study of dispersion behaviors of TiC nanoparticles in molten Al [J]. Chemical Physics, 2022, 554: 111405.

· Tao Wang,Hailong Li, Xuehong Zhang, Xin Li. First-principles calculations on physical properties of α-CoSn3 intermetallic compound and β-Sn/α-CoSn3 interface [J]. Journal of Electronic Materials, 2021, 50(5): 2813-2821.

· Tao Wang,Hailong Li, Shiguang Hao, Xuehong Zhang. Effect of Ni on the Au embrittlement in Sn/Au/Ni solder bump [J]. Journal of Materials Science: Materials in Electronics, 2021, 32(24): 28426-28435.

· Yutao Lin,Hailong Li, Gang Chen. Effect of nickel metallization thickness on microstructure evolution and mechanical properties in Sn3.0Ag0.5Cu/Au/Ni/Cu solder joints [J]. Journal of Materials Science: Materials in Electronics, 2020, 31(14): 11569-11580.

· Yiming Jiang,Hailong Li, Gang Chen, Yunhui Mei, Meiyu Wang. Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints [J]. Journal of Materials Science: Materials in Electronics, 2019, 30(6): 6224-6233.

· Hailong Li, Rong An, Chunqing Wang, Bin Li. Suppression of void nucleation in Sn3.0Ag0.5Cu/Cu solder joint by rapid thermal processing [J]. Materials Letters, 2015, 158(0): 252-254.

· Hailong Li, Rong An, Chunqing Wang, Zhi Jiang. In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging [J]. Journal of Alloys and Compounds, 2015, 634(0): 94-98.

· Hailong Li, Rong An, Chunqing Wang, Yanhong Tian, Zhi Jiang. Effect of Cu grain size on the voiding propensity at the interface of SnAgCu/Cu solder joints [J]. Materials Letters, 2015, 144(0): 97-99.